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MOQ : 1
Price : Inquiry Us
Payment Terms : T/T
Supply Ability : 200,000+ m² PCB per Month
Layer : 8 layers
Base Material : FR4 Tg170
Board Thickness : 1.5mm
Construction : 1+6+1
Min. Line Width/Space : 0.1/0.1mm
Surface Treatment : ENIG
Type : Customizable
Application : 5G Communication Equipment
Standard : UL&IPC Standard &ISO
8-layer ENIG HDI PCB High Component Density For 5G Communication Equipment
♦ What is HDI PCB?
HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.
♦ Characteristics of HDI PCB
♦ Applications of HDI PCB
♦ Technical Parameters
|  			 Item  |  			 			 Spec  |  		
|  			 Layers  |  			 			 1~64  |  		
|  			 Board Thickness  |  			 			 0.1mm-10 mm  |  		
|  			 Material  |  			 			 FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc  |  		
|  			 Max Panel Size  |  			 			 800mm×1200mm  |  		
|  			 Min Hole Size  |  			 			 0.075mm  |  		
|  			 Min Line Width/Space  |  			 			 Standard: 3mil(0.075mm) Advance: 2mil  |  		
|  			 Board Outline Tolerance  |  			 			 士0.10mm  |  		
|  			 Insulation Layer Thickness  |  			 			 0.075mm--5.00mm  |  		
|  			 Out Layer Copper Thickness  |  			 			 18um--350um  |  		
|  			 Drilling Hole (Mechanical)  |  			 			 17um--175um  |  		
|  			 Finish Hole (Mechanical)  |  			 			 17um--175um  |  		
|  			 Diameter Tolerance (Mechanical)  |  			 			 0.05mm  |  		
|  			 Registration (Mechanical)  |  			 			 0.075mm  |  		
|  			 Aspect Ratio  |  			 			 17:01  |  		
|  			 Solder Mask Type  |  			 			 LPI  |  		
|  			 SMT Min. Solder Mask Width  |  			 			 0.075mm  |  		
|  			 Min. Solder Mask Clearance  |  			 			 0.05mm  |  		
|  			 Plug Hole Diameter  |  			 			 0.25mm--0.60mm  |  		
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                        ENIG HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment Images |